Công nghệ Micro Forming

Applications of micro components in MEMS, electronic equipments A new discipline of metal forming technology is being born The problems by micro forming same as conventional forming technology, but size of billets influences strongly on behavior of materials Accuracy of parts and tools is in the first priority Creation of tools requires the exact micro machining

ppt57 trang | Chia sẻ: banmai | Ngày: 21/02/2013 | Lượt xem: 396 | Lượt tải: 0download
Tóm tắt tài liệu Công nghệ Micro Forming, để tải tài liệu về máy bạn click vào nút DOWNLOAD ở trên
Micro-Forming Technologies Overview about Technologies and its Applications Nguyen Dac Trung Head of Department of Metal forming Hanoi University of Technology Warmly welcome to visit our website to get more information www.giacongapluc.com C¸c néi dung chÝnh trong b¸o c¸o nµy ®­îc tËp hîp tõ c¸c nghiªn cøu cña c¸c tr­êng §H, viÖn nghiªn cøu vµ doanh nghiÖp t¹i Mü, CHLB §øc, Anh, NhËt, Hµn quèc, §µi Loan, ViÖt nam… Outline Introduction Products made by micro forming technologies Definition of Micro-forming and its features Some technologies using for micro forming Tools for micro forming and methods for creation of tools Conclusion Ideas and discussion 1. Introduction Thang long industrial park corprate Nomura - haiphong industrial zone Bac ninh industrial zones Vung ang industrial park-seaport complex Quang ninh industrial zone Thai nguyen industrial zones Bac vinh industrial park Thuy van industrial zone Dung quat industrial park Tinh phong industrial zone Phu tai industrial park Hoa khanh industrial park Phan thiet industrial park Danang Industrial Zone Lien chieu industrial zone Ba ria vung tau industrial zones Dong nai province Song may industrial park Amata industrial park Binh duong province Dong an industrial park Viet huong industrial park Vietnam - singapore industrial park Tan thuan export processing zone Tan binh industrial park Le minh xuan industrial park Tan tao industrial park Tan thoi hiep industrial zone Linh trung export processing zone Industrial Fields Automobile Industry Toyota Vietnam Building Industry Transportation Industry Plastics Industry Telecommunication Industry Heavy Industry Electrical Industry Electronics Industry Chemical Industry Food Industry Metallurgical Industry Steel work Manufacturing Housewares Industry NEW WAVE OF INVESTMENT IN HIGH TECH Foreign companies invest in big projects of high- tech industry with capital size from hundreds million USD to billions USD. New opportunities ON DEMAND SIDE ON SUPPLY SIDE New challenges NEW WAVE OF INVESTMENT IN HIGH TECH Intel Product Company - Invested in a project of USD 1 billion =>requires 1000 engineers specialized in electrical engineering, electronics, information technology, automation Renesas company of Japan - To build a design center in Vietnam =>needs 1.000 engineers. - All of functions of design centers in Japan and the United States will be transferred to the Vietnam Renesas Center Hon Hai corporation – Taiwan, investing in Vietnam. - Global turnover => 60 bil. USD /year - Products: electronic products used in mobile, computer part, telecommunication, and home electronics - Next five years, to invest USD 5 bill.=> needs over 50.000 workers NEW WAVE OF INVESTMENT IN HIGH TECH 4. Campal company – Taiwan investing in Vietnam Production of laptops and electronic products First phase of the project USD 500 mil. in Vinh Phuc Recruiting 1200 engineers to train them oversea Huge demand of skilled workers 5. Quang Trung Software Park in Ho Chi Minh City 78 enterprises and 32 investment projects; 46 foreign enterprises from 14 countries (United States, Japan, France, Swiss, Korea, Thailand...) Total capital of 150 mil. USD Employees: 3,100 engineers and IT experts 4.500 IT undergraduate students are trained in international and domestic university programs Products in Electronic Micro-products ??? 2. Products made by micro forming technologies Micro Miniature Forming Metal Stamping and Forming Products made by micro-stamping (punching, drawing) Products made by micro-stamping (punching, bending, drawing) Products made by micro-stamping (punching, bending, drawing) Micro-equipments Electro-kinetic pump Products made by micro-bulk forming Products made by micro-bulk forming Tube products 3. Definition of micro-forming and its features Forming of parts/elements with geometries only a few millimeters down to several micrometers Features: Size effects Assembly, alignment of tools Using of continuous tools Lubrications Temperatures Size effects in micro-forming Flow stresses are depending on blank thickness Size effects of friction Process design FE-Simulation Tool design MD-Simulation Stamping: Bending, Punching, Blanking, Drawing… Bulk forming: Extrusion, Close die forging without flange Embossing 4. Some technologies using for micro forming Examples of extruded micro-parts Extrusion technologies Extrusion technologies Bolster Subbolster Die Mandrel Die holder Tool container 1 2 3 4 5 6 Extrusion technologies Extrusion technologies Cold forging technology Spring-Suspended Pre-Upsetting Punch Micro embossing Micro embossing Principle of laser-assisted micro forming Sapphire tool for embossing and imprint in aluminium Punching on continuous die Punching for producing of gears Micro deep drawing for producing of conectors Thickness: 0.04 mm Dia. of punch: 1.0 mm Dia. of Die: 1.08 mm Micro-hydroforming of tubes Tools for micro-forming Assembly and Trying out Assembly and Trying out Tools for micro-forming Metal Micro Gear Side view of wire EDM stainless steel micro well embossing insert Micro well embossing insert Tool for Stamping Tool for Extrusion Micromachining and Nanomachining Technologies 1. Laser micromachining of 'small' 3D micro structures (in range 1 to 500 microns) using picosecond laser. 2. Laser micromachining of 'large' 3D micro structures (in range 50 microns to 1mm) using microsecond laser. 3. High speed micromachining and micromilling; 4. EDM micromachining of micro structures and discrete parts (micro-wire and micro-volume EDM). 5. Microinjection mould tool manufacture and moulding using Battenfeld micromoulding machine. 6. Spin coating and electroforming. 5. Methods for creation of micro-tools Subcontract Laser Micromachining 3D microsecond laser micromachining capability offering feasibility trials, subcontract batch manufacture, process and product development, job shop and contract research. Materials Metals Ceramics Applications Surface structures in the range 50 microns upwards Through holes, slots, blind holes and pockets, 3D milled and machined structures Vertical wall machining and 2.5D machining Micro drilling, micro cutting Technical Capabilities of Microsecond Laser Machining Centre Laser type.............................................Nd:Yag Wavelengths.........................................1064 nm Minimum spot diameter..........................45 microns Pulsed operation, pulse length.................2-10 microseconds Repetition rate.......................................0.1 - 50 kHz Vertical wall machining capability..............aspect ratio of 2 Tapered wall machining capability.............aspect ratio of 5 to 10 Tapered wall machining angle..................6 to 8 degrees (material dependent) Deep hole drilling...................................variable depending on diameter Machining accuracy.................................+/- 20 microns closed loop control. Average power of laser...........................Up to 100 Watts Materials...............................................Metals, ceramics, opaque glassy materials, graphite. 3D CAD data format...............................STL, DXF Laser Micromachining : Microsecond 3D machining Kern High Speed Micro Milling and Machining Spindle Speed.......................>100,000 revs/min Cutter size...........................100 micron diameter typical Cut depth............................1 to 10 microns per pass depending on material and cutter size Aspect ratio..........................Up to 5 depending on structure Materials..............................Steels, other metals, some polymers and some ceramics Surface roughness................1 to 5 microns Ra average roughness depending on material and cutter Micromachining : 5-axis micro-milling EDM technology EDM and Micro EDM: Partnership with SARIX (www.sarix.com), Swiss company expert in micro EDM EDM principle: Electrical field (U and I) between the electrode and the workpiece Creation of a discharge channel Channel ionization Increase of T and P Spark and explosion Material removal Micro EDM: Very short electrical pulses High energy discharges. High quality and material remove rate Micro-EDM For micro-holes, micro-machining and micro-forms High precision micro-holes and shape holes down to 20 microns High precision positioning accuracy up to +/- 1 micron Micro-EDM Micro Wire EDM Machine HIT-100 Main Features:   High-rigidity structure Granite basement RC micro energy pulse generator with precise control Piezoelectric ceramics motors V-block guide mechanism Low speed circulate moving wire transportation system Micro EDM machining function Windows XP operating system Basic Specifications A Swiss-type lathe with air spindles offers the capability to perform "general" turning and milling operations, as well as drilling of micro-holes. Micro-EDM is used for tubing or other parts in which deburring a drilled hole would be difficult or impossible. Wire EDM Wire EDM Micro Wire EDM EDM Micromachining : micro-wire and micro-volume The micro wire EDM is ideal for cutting profiles in metal plates, makig slots and various shapes for many different applications. The minimum wire diameter is 20 microns which allows for very small profile structures with tight radii to be made. It is also possible to get surface roughness of Ra 0.07 microns. For injection mould tool applications, a draft angle of up to 2.5 degrees is achievable Micro Wire EDM Examples of Parts Manufactured using Micro Wire EDM Wire EDM a microfluidics mixer (top left and right); 0.52mm dia extrusion die (12 pointed star); Pin over-moulding jig (655 micron holes); Ladder with 100 micron gaps between teeth; Micro gears. Application of micro-EDM combined with high-frequency dither grinding to micro-hole machining An associated technique is micro wire EDM turning. In this process, the EDM electrode wire is used as a cutter while turning the work piece. This technique is ideal for making very high aspect ratio turned micro parts such as the touch probe illustrated and deep micro hole drilling electrodes. Micro Touch Probe manufactured using Micro Wire EDM Turning The micro volume EDM is ideal for making high aspect ratio features and holes assuming the elecrodes are manufacturable. Holes of 200 micron diameter and 6mm deep have been drilled, slots of 70 micros in width have been drilled through 0.5mm. This technique is ideal for many deep relief micro structures in the size range 50 microns to 1mm and above. Micro Volume EDM, EDM Drilling EDM Drilling Using Solid Electrodes Micro- EDM Holes as small as 6.5 microns in diameter and an aspect ratio of 7.5 is machined using EDM Micro-Turning Shafts of 30 microns in diameter up to an aspect ratio of 200 by micro-turning. Micro-Milling 70-micron fins. Micro-Milling 100-micron slots via micro-milling. Micro-EDM 30-micron shafts and 50-micron holes produced by micro-EDM. Micro-Wire Cut EDM Slots of 50 microns in width produced by wire-cut EDM. Hybrid machining of Micro EDM and Micro Milling Fine features can be machined using hybrid machining processes on difficult to machine materials such as glass  Focused Ion Beam FIB nanomachining Technical Capabilities of FIB Nano Machining Centre Ion beam..............................................Gallium Capability..............................................Machining and deposition Minimum ion beam spot diameter.............20 nano metres Minimum feature size..............................20 nano metres Vertical wall machining capability...............Aspect ratio of 2 Tapered wall machining capability..............Aspect ratio of 5 to 10 Tapered wall machining angle...................2 degrees minimum for high aspect ratios Deep hole drilling....................................Variable depending on diameter Work piece movement accuracy...............+/- 2 microns or better Work piece movement repeatability..........+/- 1 micron Machining depth control accuracy.............+/- 20 nano metres or better Work piece............................................4 inch diameter, 20mm deep Maximum exposure area.........................500 x 500 microns Deposition materials...............................Tungsten, platinum, silicon dioxide SEM image resolution.............................1.1 at 20kV, 2.5 at 1kV Machining feedback.................................Real time SEM imaging during milling FIB samples below:- left: 75nm grooves in alumina (gold coated); right: 80nm grooves in grid FIB samples above:- left: silicon dioxide wall structure; right: SEM analysis sample 6. Conclusion Applications of micro components in MEMS, electronic equipments… A new discipline of metal forming technology is being born The problems by micro forming same as conventional forming technology, but size of billets influences strongly on behavior of materials Accuracy of parts and tools is in the first priority Creation of tools requires the exact micro machining 7. Ideas and Discussion Thank you so much for your attention !!!

Các file đính kèm theo tài liệu này:

  • pptBai giang Microforming.ppt