Bài giảng Digital electronics - Part 1: Digital Principle - Lê Dũng

DIGITAL INTEGRATED CITCUITS  Most of the reasons that modern digital systems use integrated circuits  IC pack a lot more circuitry in a small package  the overall size of any digital system is reduced.  IC have made digital systems more reliable by reducing the number of external interconnections.  IC typically requires less power than their discrete counterparts saving in power and a system does not require as much cooling DIGITAL INTEGRATED CITCUITS  Logic Families DL : Diode Logic. RTL : Resistor Transistor Logic. DTL : Diode Transistor Logic. HTL : High Threshold Logic. TTL : Transistor Transistor Logic. I2L : Integrated Injection Logic. ECL : Emitter Coupled Logic. MOS : Metal Oxide Semiconductor Logic (PMOS and NMOS). CMOS : Complementary Metal Oxide Semiconductor Logic. BiCMOS : Combines bipolar and CMOS devices into single integrated circuit.

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9/9/13 1 Digital Electronics - Part I: Digital Principle - Dr. Lê Dũng Department of Electronics and Computer System (C9-401) School of Electronics and Telecommunications Hanoi University of Science and Technology Email: ledung-fet@mail.hut.edu.vn Part I: Digital Principles - Overview Boolean Functions (Boolean Algebra) True False 1 0 High Low Basic Logic Gates Inverter,AND,OR,NAND,NOR,XOR,XNOR Electronic circuits (Transistor BJT, Diode, Resister, MOS...) Implementation Digital System Digital Integrated Circuits Information Digitalization Logic Level Logic Clause Sequential Logic Circuits Combinational Logic Circuits Logic Circuits Analysis & Synthesis -  Custom design -  Standard cell design - Gate array -  PLA, PLD, FPGA -  FSMD design - VHDL Logic Families RTL, DTL, HTL TTL, CMOS PMOS, NMOS, BiMOS, ECL, Specifications: - Current & Voltages - Fan-in, Fan-out - Propagation Delay - Noise Margin - Power Dissipation - Speed Power Product Open-Collector Output & Tristate Output Dr. Le Dung - School of Electronics and Telecommunications Page 2 9/9/13 2 Part I: Digital Principles - Contents Chapter 1 : Binary system and Binary Codes Chapter 2 : Boolean Algebra Chapter 3 : Logic Gates, Logic Circuits and Digital Integrated Circuits Dr. Le Dung - School of Electronics and Telecommunications Page 3 Logic Gates, Logic Circuits and Digital Integrated Circuits Chapter 3 3.1 Logic Gates + Electronic switches and Logic Levels in Digital Circuits + Basic Logic Gates 3.2 Logic Circuits + Principles of Logic Gate Connection + Two models of Logic Circuit + Synthesis and Analysis Logic Circuits + Active Level and Active Level Conversion 3.3 Digital Integrated Circuits + Integrated Circuit (IC) and Scale of Integration. + Digital IC Families (TTL, CMOS) + Specifications of Digital IC Dr. Le Dung - School of Electronics and Telecommunications Page 4 9/9/13 3 Dr. Le Dung - School of Electronics and Telecommunications Page 5 3.1 LOGIC GATES  Digital circuits work with 0 and 1 and use “switches” Ref.: How to make an electronic “switch” in digital circuit ?. Dr. Le Dung - School of Electronics and Telecommunications Page 6 3.1 LOGIC GATES  BJT works as a switch in a digital circuits Ref.: Cut-off Saturation BJT switches  TTL families 9/9/13 4 Dr. Le Dung - School of Electronics and Telecommunications Page 7 3.1 LOGIC GATES  MOSFET works as a switch in a digital circuits N-MOSFET (N-Channel Metal–Oxide– Semiconductor Field-Effect Transistor Cut-off Full-saturation Ref.: MOSFET switches  CMOS Families Dr. Le Dung - School of Electronics and Telecommunications Page 8 3.1 LOGIC GATES  Logic Levels: are usually represented by the voltage ranges. 9/9/13 5 Dr. Le Dung - School of Electronics and Telecommunications Page 9 3.1 LOGIC GATES  Logic Levels: VCC, VIH, VIL, VOH,VOL Dr. Le Dung - School of Electronics and Telecommunications Page 10 3.1 LOGIC GATES  A Logic Gate is physical device implementing a basic Boolean function and working on logic levels. Logic gates are primarily implemented using diodes or transistors acting as electronic switches 9/9/13 6 Dr. Le Dung - School of Electronics and Telecommunications Page 11 3.1 LOGIC GATES  7 Logic Gates Dr. Le Dung - School of Electronics and Telecommunications Page 12 3.1 LOGIC GATES  Logic Gates in Small Scale Integrated IC Hex (6) Inverters IC 7404 INVETER gate TTL inverter gate circuit 9/9/13 7 Dr. Le Dung - School of Electronics and Telecommunications Page 13 3.1 LOGIC GATES  Logic Gates in Small Scale Integrated IC Quadruple 2-Input And-gates IC 7408 AND gate TTL AND gate circuit Dr. Le Dung - School of Electronics and Telecommunications Page 14 3.1 LOGIC GATES  Logic Gates in Small Scale Integrated IC Quadruple 2-Input OR-gates IC 7432 OR gate TTL OR gate circuit 9/9/13 8 Dr. Le Dung - School of Electronics and Telecommunications Page 15 3.1 LOGIC GATES  Logic Gates in Small Scale Integrated IC Quadruple 2-Input NAND-gates IC 7400 NAND gate TTL NAND gate circuit Dr. Le Dung - School of Electronics and Telecommunications Page 16 3.1 LOGIC GATES  Logic Gates in Small Scale Integrated IC Quadruple 2-Input NOR-gates IC 7402 NOR gate TTL NOR gate circuit 9/9/13 9 Dr. Le Dung - School of Electronics and Telecommunications Page 17 3.1 LOGIC GATES  Logic Gates in Small Scale Integrated IC Dr. Le Dung - School of Electronics and Telecommunications Page 18 3.2 LOGIC CIRCUITS  Principles of Logic Gate Connection The rules of connection ?. 9/9/13 10 Dr. Le Dung - School of Electronics and Telecommunications Page 19 3.2 LOGIC CIRCUITS  Principles of Logic Gate Connection e.g. TTL output connects to CMOS input Dr. Le Dung - School of Electronics and Telecommunications Page 20 3.2 LOGIC CIRCUITS  Principles of Logic Gate Connection  the rules + Must be compatible in logic level + One output can control more than one input + Two or more outputs usually should not be connected together. + Don’t let an input as a floating input. 9/9/13 11 Dr. Le Dung - School of Electronics and Telecommunications Page 21 3.2 LOGIC CIRCUITS  Two models of Logic Circuits Dr. Le Dung - School of Electronics and Telecommunications Page 22 3.2 LOGIC CIRCUITS  Synthesis and Analysis Logic Circuits 9/9/13 12 Dr. Le Dung - School of Electronics and Telecommunications Page 23 3.2 LOGIC CIRCUITS  Active Level (Asserted level) Dr. Le Dung - School of Electronics and Telecommunications Page 24 3.2 LOGIC CIRCUITS  Active Level Conversion 9/9/13 13 Dr. Le Dung - School of Electronics and Telecommunications Page 25 3.2 LOGIC CIRCUITS  Alternated Logic Gates (active level conversion) Dr. Le Dung - School of Electronics and Telecommunications Page 26 3.2 LOGIC CIRCUITS  Active level conversion to make a compatible in logic circuits 9/9/13 14 Dr. Le Dung - School of Electronics and Telecommunications Page 27 3.2 LOGIC CIRCUITS  Exercise 1: active level conversion Dr. Le Dung - School of Electronics and Telecommunications Page 28 3.2 LOGIC CIRCUITS  Exercise 2: active level conversion 9/9/13 15 Dr. Le Dung - School of Electronics and Telecommunications Page 29 3.3 DIGITAL INTEGRATED CITCUITS   Integrated Circuit ?. An integrated circuit (also referred to as IC, chip, or microchip) is an electronic circuit manufactured by lithography All logic gates, logic circuits  implemented on a single chip  Digital ICs Dr. Le Dung - School of Electronics and Telecommunications Page 30 3.3 DIGITAL INTEGRATED CITCUITS  Lithography for integrated circuit fabrication Pattern transfer 9/9/13 16 Dr. Le Dung - School of Electronics and Telecommunications Page 31 3.3 DIGITAL INTEGRATED CITCUITS  Scale of Integration * Giga-scale integration(GSI) 1,000,000 or more(109 - 1011) * Tera-scale integration(TSI) (1012 or more) Moore’s Law: The number of components that can be packed on a computer chip doubles every 18 months while price stays the same. 1.2 Billion individual transistor gates onto the Quad-core i7-2700k "Sandy Bridge" 64-bit microprocessor chip Dr. Le Dung - School of Electronics and Telecommunications Page 32 3.3 DIGITAL INTEGRATED CITCUITS  Most of the reasons that modern digital systems use integrated circuits  IC pack a lot more circuitry in a small package  the overall size of any digital system is reduced.  IC have made digital systems more reliable by reducing the number of external interconnections.  IC typically requires less power than their discrete counterparts saving in power and a system does not require as much cooling 9/9/13 17 Dr. Le Dung - School of Electronics and Telecommunications Page 33 3.3 DIGITAL INTEGRATED CITCUITS  Logic Families DL : Diode Logic. RTL : Resistor Transistor Logic. DTL : Diode Transistor Logic. HTL : High Threshold Logic. TTL : Transistor Transistor Logic. I2L : Integrated Injection Logic. ECL : Emitter Coupled Logic. MOS : Metal Oxide Semiconductor Logic (PMOS and NMOS). CMOS : Complementary Metal Oxide Semiconductor Logic. BiCMOS : Combines bipolar and CMOS devices into single integrated circuit. Dr. Le Dung - School of Electronics and Telecommunications Page 34 3.3 DIGITAL INTEGRATED CITCUITS  Digital IC notation 9/9/13 18 Dr. Le Dung - School of Electronics and Telecommunications Page 35 3.3 DIGITAL INTEGRATED CITCUITS  DL, RTL, DTL, HTL structures DTL - NAND gate Diode logic Dr. Le Dung - School of Electronics and Telecommunications Page 36 3.3 DIGITAL INTEGRATED CITCUITS  IIL structures - Integrated injection logic (IIL, I2L, or I2L) is a class of digital circuits built with multiple collector bipolar junction transistors (BJT) - When introduced it had speed comparable to TTL yet was almost as low power as CMOS, making it ideal for use in VLSI (and larger) integrated circuits. - Although the logic voltage levels are very close (High: 0.7V, Low: 0.2V), 9/9/13 19 Dr. Le Dung - School of Electronics and Telecommunications Page 37 3.3 DIGITAL INTEGRATED CITCUITS  ECL structures - A high-speed integrated circuit bipolar transistor logic family. - ECL uses an overdriven BJT differential amplifier with single-ended input and limited emitter current to avoid the saturated (fully on) region of operation and its slow turn-off behavior Dr. Le Dung - School of Electronics and Telecommunications Page 38 3.3 DIGITAL INTEGRATED CITCUITS  The structure of standard TTL NAND Gate: Multiple emitter and Totem pole 9/9/13 20 Dr. Le Dung - School of Electronics and Telecommunications Page 39 3.3 DIGITAL INTEGRATED CITCUITS  The operation of standard TTL NAND gate Dr. Le Dung - School of Electronics and Telecommunications Page 40 3.3 DIGITAL INTEGRATED CITCUITS  The operation of standard TTL NAND gate 9/9/13 21 Dr. Le Dung - School of Electronics and Telecommunications Page 41 3.3 DIGITAL INTEGRATED CITCUITS  Tri-state or Hi-Z output of TTL gate Dr. Le Dung - School of Electronics and Telecommunications Page 42 3.3 DIGITAL INTEGRATED CITCUITS  Tri-states output application 9/9/13 22 Dr. Le Dung - School of Electronics and Telecommunications Page 43 3.3 DIGITAL INTEGRATED CITCUITS  Open collector output of TTL gate Wired-OR circuits Different voltage Interfacing Dr. Le Dung - School of Electronics and Telecommunications Page 44 3.3 DIGITAL INTEGRATED CITCUITS  Structure of Low-power Schottky TTL 9/9/13 23 Dr. Le Dung - School of Electronics and Telecommunications Page 45 3.3 DIGITAL INTEGRATED CITCUITS  Structure of NMOS gate Dr. Le Dung - School of Electronics and Telecommunications Page 46 3.3 DIGITAL INTEGRATED CITCUITS  Structure of CMOS gate 9/9/13 24 Dr. Le Dung - School of Electronics and Telecommunications Page 47 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Currents & Voltages   Fan-out, Fan-in   Propagation Delay   Noise Margin   Power Dissipation   Speed Power Product From Datasheet Dr. Le Dung - School of Electronics and Telecommunications Page 48 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Voltages and Noise Margin 9/9/13 25 Dr. Le Dung - School of Electronics and Telecommunications Page 49 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Currents & Fan-out, Fan-in Dr. Le Dung - School of Electronics and Telecommunications Page 50 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Currents of the logic families 9/9/13 26 Dr. Le Dung - School of Electronics and Telecommunications Page 51 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Propagation Delay Dr. Le Dung - School of Electronics and Telecommunications Page 52 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Propagation delay of the TTL and CMOS families 9/9/13 27 Dr. Le Dung - School of Electronics and Telecommunications Page 53 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Power Dissipation and Speed-Power Product Dr. Le Dung - School of Electronics and Telecommunications Page 54 3.3 DIGITAL INTEGRATED CITCUITS  Specifications of Digital IC   Speed and power dissipation of TTL and CMOS families 9/9/13 28 Dr. Le Dung - School of Electronics and Telecommunications Page 55 3.3 DIGITAL INTEGRATED CITCUITS  TTL and CMOS connections Dr. Le Dung - School of Electronics and Telecommunications Page 56 3.3 DIGITAL INTEGRATED CITCUITS  TTL and CMOS connections (cont.) 9/9/13 29 Dr. Le Dung - School of Electronics and Telecommunications Page 57 3.3 DIGITAL INTEGRATED CITCUITS  TTL and CMOS connect to LED Dr. Le Dung - School of Electronics and Telecommunications Page 58 3.3 DIGITAL INTEGRATED CITCUITS  TTL and CMOS connect to a push button or a relay

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