The cathodic deposition efficiencies reported in Table 3, are considerably high above 90 % and tend to decrease with increasing current density in the investigated range from 30 to 50 mA/cm'. In contrary, lead recovery efficiencies are increased with current densities in same range with a sharp rise is observed at 50 mA/cm current density (Table 4). In practice, the necessary current density can be selected depending on efficiency requirements, considering the values of the product to be recovered on each electrode.
9 trang |
Chia sẻ: honghp95 | Lượt xem: 623 | Lượt tải: 0
Bạn đang xem nội dung tài liệu Copper and lead recovery from discarded printed circuit boards by electrolysing leached solution - Tran Thi Phuong Thao, để tải tài liệu về máy bạn click vào nút DOWNLOAD ở trên
Journal of Science and Technology 55 (1B) (2017) 129–137
COPPER AND LEAD RECOVERY FROM DISCARDED PRINTED
CIRCUIT BOARDS BY ELECTROLYSING LEACHED SOLUTION
Tran Thi Phuong Thao1, *, Nguyen Trung Hai Thinh1, Ung Thai Le Anh1,
Lam Nguyen Tuong Dao2, Tran Van Man1, 2, Nguyen Nhi Tru3
1 Department of Physical Chemistry, Faculty of Chemistry, University of Science – VNU HCM
227 Nguyen Van Cu Street, Ward 4, District 5, Ho Chi Minh City, Vietnam
2Laboratory of Applied Physical Chemistry, Faculty of Chemistry,
University of Science – VNUHCM, 227 Nguyen Van Cu Street, Ho Chi Minh City, Vietnam
3Department of Energy Materials and Applications, Faculty of Materials Technology,
HCMUT – VNUHCM, 268 Ly Thuong Kiet Street, District 10, Ho Chi Minh City, Vietnam
*Email: closefriend83@gmail.com
Received: 30 December 2016; Accepted for publication: 3 March 2017
ABSTRACT
Results of copper and lead recovery from discarded printing circuit boards (PCB) by acidic
dissolution and electrodeposition are presented. A preliminary procedure of the recovery process
is proposed with the following steps: disposal of the mounted electrical elements, cleaning,
grinding, iron separation for grains screening, metal dissolution, and electrolysis. The
composition analysis is performed to define suitable electrochemical parameters for recovery.
XRF and AAS techniques are used for preliminary estimation of metal content in leached
solution. LSV method is implemented to establish parameters for copper electrodeposition. The
product quality is evaluated through XRD analysis. The high recovery efficiencies, 97.61% and
96.59 % for copper (in metallic form) and lead (in dioxide form), respectively, were reached.
Keywords: printing circuit board, copper and lead recovery, dissolution, electrodeposition.
1. INTRODUCTION
Due to the growing consumption of electronic devices and tendency of their shorter end–
of–life, the modern world is facing a rapid accumulation of electronic wastes (e–waste). With
global discarded amount estimated at 41.8 million tons in 2014 [1, 2] and 4–5 % increase
annually [3], e–waste has become an emerging problem for the environment nowadays.
However, alongside the negative impact on environmental issues, which are to be solved by
appropriate treatment measures, e–waste is considered as a potential reusable resource for
different materials, especially metals and their compounds. Yan Xu et al. data for 2014 provide a
considerable quantity of iron (16.5 million tons), copper (1.9 million tons), gold (300 tons), and
a significant amount of other precious metals such as silver, palladium, etc. with an estimated
Copper and lead recovery from discarded printed circuit boards by electrolysing leached solution
130
value of about US $52 billion [2]. Discarded printing circuit boards (PCB), which has been
recovered for years, comprise a substantial amount of valuable metals. Copper and lead are the
main metals recovered due to their higher contents in discarded PCB and in e–wastes. Various
processes have been applied to extract these metals and have normaly been divided on thermal
and non–thermal methods including chemical and/or electrochemical steps [3]. Based on the
different deposition potentials, the electrochemical approach has widely been applied to remove
various metals from leachates.
According to Vijayaram R. et al. [3], copper could be obtained from PCB waste by non–
thermal method through chemical treatment with 8.5 – 92.7 % efficiency, depending on used
acid compositions. Nitric acid and its mixture with hydrochloric acid are proven to be the most
suitable solvents for copper extraction. Similarly, Andrea M. and Keith S. [4] used nitric acid to
dissolve copper and lead. Metallic copper and lead in the lead dioxide form were recovered in
the followed step by electrolysis. Kumar M. et al. [5] reported 98.3 % efficiency of copper
recovery from leachate under optimum conditions of 800 rpm agitation and 60 oC using 3 mM/L
nitric acid.
Sulfuric acid was also used as leaching agent to extract copper and other metals from
e–wastes [6–9]. Due to the unavailability of direct copper transformation into its sulfate salt,
oxidizing agents such as hydrogen peroxide are required. With 1 M H2SO4+H2O2 mixture,
82.1 % dissolution efficiency was reached by Nguyen T. T. H. et al. [9]; meanwhile, 88.07 %
extraction efficiency was shown for copper by Zhang Z. J. [2]. To improve the copper
extraction, aqua regia was added to sulfuric acid and 98 % efficiency was reported by Weit H.
M. et al. [6].
Nowadays, selective and efficient recovery of metals from e–waste is considered a
challenging issue. In this paper, the results of copper and lead recovery from discarded PCB are
provided based on a non–thermal technique using nitric acidic as leaching agent followed by
electrodeposition.
2. MATERIALS AND METHODS
2.1. Procedure of PCB recycling process
Discarded PCBs were collected from e–waste slump and all active and passive components
were dismantled before transferring to the recycling process.
The scraps were thoroughly rinsed, dried, weighed and fed to ball milling process until
powder with maximal grain sizes of 1 mm was achieved. Then, a magnetic device was used to
separate iron fillings from the powder. The following steps were conducted as described
according to the block diagram in Figure 1. This diagram was designed based on a generally
accepted procedure [3, 10] with some modifications: by adding the second electrolysis step for
copper deposition and the anodic lead removal. The modifications were introduced assuming
that both metals occurred at high content in PCB scraps and copper recovery was preferential as
more valuable material.
The grinded powder was dissolved in 6 M nitric acid (1 :1 ratio) at room temperature,
followed by filtration to separate leachate from residues containing H2SnO3 and other solid
substances. The leached solution was then analyzed to reveal elemental contents and underwent
first step electrolysis afterwards.
ele
wa
ele
sol
con
com
2.2
con
vo
ele
per
pe
ele
con
ele
me
PbO2 and
ctrodepositi
ter, dried a
ctrodepositi
ution using
ducted for
pound in f
. Electroche
A prelim
ducted on
ltammetry (
ctrode, plat
formed in a
The linea
aks during
ctrolysis. P
ducted for
ctrode. Sur
asurements
copper wer
on process.
nd weighed
on after diss
nitric acid to
metallic le
orm of PbO2
Fi
mical inves
inary electr
Metrohm A
CV) techniq
inium count
potential wi
r sweep volt
electrolysis,
otential swe
similar cell
face area
were conduc
e deposited
The formed
. Simultane
olution in 6
receive Pb
ad depositio
was recover
gure 1. Block
tigation
ochemical i
utolab PGS
ue in the
er electrode
ndow rangin
ammetry (L
followed b
pt at 2 mV
with Ag/A
of copper
ted on the B
on the anod
anodic prod
ously, the
M nitric aci
2+ solution,
n. Howeve
ed and the l
diagram of P
nvestigation
TAT 30 p
conventiona
, and Ag/A
g from –0.8
SV) was als
y further d
/s scan rate
gCl referenc
working el
iologic MPG
e and catho
uct was the
cathodic co
d. The obtai
from which
r, in this w
ast step was
CB treatmen
of mixed
otentiostat (
l three elec
gCl referen
to 0.5 V at 5
o applied to
etermination
and in the
e electrode
ectrode wa
2 (France).
Tran Th
de respectiv
n separated,
pper was p
ned PbO2 ca
the second
ork the fin
not conduct
t process.
copper and
The Nether
trode cell w
ce electrode
0 mV/s scan
identify red
of optimal
range of –
and platiniz
s defined a
i Phuong Th
ely as a resu
rinsed with
urified by
n be transfe
step electro
al product
ed.
lead solu
lands), usin
ith glassy
. The scann
rate.
uction and o
current de
0.9 to –0.
ed titanium
s 0.071 c
ao, et al.
131
lt of the
distilled
repeated
rred into
lysis was
for lead
tion was
g cyclic
working
ing was
xidation
nsity for
1 V was
counter
m2. The
Copper and lead recovery from discarded printed circuit boards by electrolysing leached solution
132
Electrodeposition was processed in an electrolyzer with GW Instek GPR–3510HD DC
power supply at various current densities and solution stirring of 600 rpm. As in LSV case,
copper and platinized titanium were selected as cathode and anode respectively. The efficiency
of the electrolysis process was determined as a percentage ratio between the experimental data
obtained by mass gain method (difference of the electrode mass weighed before and after
electrolysis) and the data calculated by Faraday law (mୟ୰. ൌ ∙ ܫ߬, where ݉ி. is the
calculated mass gain, M is the molar mass, z is the valency number, F is the Faraday constant, I
is the current, and τ is the total electrolysis time).
2.3. Elemental analysis and characterization
The leachate collected after PCB powder dissolution in HNO3 was filtrated for separation
from H2SnO3 and other residues, followed by elemental analysis using X–ray fluorescence
(XRF) and Atomic absorption spectroscopy (AAS) techniques.
The XRF analysis was conducted on SPECTRO XEPOS XRF Spectrometer in the Center of
Analytical Services and Exprimentation of Hochiminh City (CASE). The AAS determination of
Cu and Pb content was performed on AAS spectrophotometer from the Laboratory for
Analytical Chemistry (Hochiminh City University of Science). Another volume of leachate was
analyzed for iron content using AAS technique to determine the efficiency of the magnetic iron
separation.
Phase compositions of the electrodeposited metals were identified by X–ray diffraction
method on Bruker XRD–D8 Advance in the Center for Innovative Materials and Architectures
(INOMAR) of Ho Chi Minh City.
3. RESULTS AND DISCUSSION
3.1. Metal composition of the PCB scrap
Considering the material composition, e–waste can be defined as a mixture of numerous
metals and alloys, particularly copper, lead, aluminum, steel, etc. alongside the various types of
ceramics and plastics [10]. To clarify the metallic composition, the PCB scrap was dissolved in
6M nitric acid as described in 2.1 and its leachate was analyzed by XRF technique. The analyzed
results were calculated as percentage to initial PCB scrap mass and presented in Table 1.
Table 1. Metallic composition of PCB leachate (%).
Element Si P K Ca Ti V Cr
m (%) 0.0020 0.00023 0.0244 0.0132 < 0.0006 0.00025 0.00021
Element Mn Fe Co Ni Cu Zn As
m (%) < 0.0011 0.0086 0.00082 < 0.00071 5.552 0.05287 < 0.00065
Element Zr Mo Ag Cd In Sn Sb
m (%) 0.020 0.0110 < 0.0016 < 0.0017 0.0022 0.01349 < 0.0034
Element Te Ba Hg Tl Pb Bi Sr
m (%) < 0.0047 0.0260 < 0.00079 < 0.0025 2.596 0.01048 0.00248
oc
ma
Ot
dat
iro
ele
lea
ele
C
ext
tec
3.2
we
(T
cle
Data liste
curred in co
terial is prev
her element
a reported b
Simultane
n, copper an
ctrolysis ste
d compared
ments occur
Element
oncentration (
The analy
racted from
hnical and e
. Investigat
To define
ll as to the
able 2).
Figure
The cycli
arly shows t
d in Table 1
nductive tra
iously remo
s in Table 1
y others auth
ously, AAS
d lead in le
p. Results p
to iron, wh
red at unsign
Table
mg/L)
tical results
discarded
conomical p
ion of electr
the electrod
simulated s
2. Cyclic volt
c voltammo
wo distinct
show high
ites and lea
ved from le
are quantif
ors, namely
analysis w
achate. The
resented in T
ich proved
ificantly low
2. Results of
Fe
3.25
show a sig
PCB scraps
oint of view
odeposition
eposition pa
olutions pre
ammogram re
gram in Fig
peaks at –0.
content of c
d is used in
achate after
ied in minu
3.4 to 10%
as also appl
se values we
able 2 refle
an effective
content an
leachate’s an
nificantly h
, the recov
.
process
rameters, C
pared with
corded for m
ure 2, recor
25 V and –0
opper and le
tin–lead so
filtration in t
te contents.
for copper a
ied to determ
re necessar
ct a prefera
method for
d were not i
alysis by AA
Pb
5,901.88
igh content
ery of whic
V and LSV
copper and
ixed copper a
ded for the
.47 V at cat
Tran Th
ad in wasted
lder. Tin as
he form of H
These data
nd 0.2 to 1.0
ine the exa
y for calcula
bly higher c
separation
nvestigated f
S technique.
of copper
h is worth
were applie
lead conce
nd lead soluti
mixed copp
hodic branc
i Phuong Th
PCB, wher
a common
2SnO3 prec
are compara
% for lead
ct concentr
tion of effic
ontent of co
of iron fillin
urthert in th
Cu
12,796.60
and lead in
considering
d to PCB le
ntrations in
on (Ag/AgCl
er and lead
h, characteri
ao, et al.
133
e copper
welding
ipitation.
ble with
[10].
ations of
iency of
pper and
g. Other
is work.
leachate
from a
achate as
leachate
).
solution,
zing two
Co
13
spe
Th
res
ran
hig
sol
ob
in
an
ste
sur
pro
sec
(iv
on
at
pper and lea
4
cific reactio
e reversible
ults also sh
ge around –
Theoretic
h hydrogen
utions with
tained only u
the aerated
odically form
ps: (i) the e
face; (ii) th
duct of Pb(
ond electron
) the latter d
This prop
both electro
2θ = 43.5°,
d recovery
ns of lead a
reactions ar
ow high sel
0.25 V SCE
ally, the sta
overpoten
a cathodic e
nder fast CV
mixed solu
ed. Accord
lectron tran
e nucleus in
III) (e.g. Pb
, forming P
ecomposes t
Figure 3
osed mecha
des after ele
50.6° for co
from discard
nd copper c
e revealed fo
ectivity of c
deposition p
ndard potent
tial, this m
fficiency app
scanning (
tions, metall
ing to Velich
sfer and gen
teracts with
(OH)2+ type
b(IV) comp
o form PbO2
. XRD patter
nism was pr
ctrolysis. X
pper (JCPD
ed printed c
ations reduc
r the anodic
opper reduc
otential.
ial for lead
etal can ea
roaching 10
50 mV/s). In
ic copper is
enko et al.
eration of
lead ions,
); (iii) the
ounds assoc
.
ns of cathodic
actically con
RD patterns
S card No.
ircuit boards
tion (Cu2+ +
branch with
tion if cath
in aqueous
sily electro
0 % as reve
practical co
cathodical
[12], lead di
oxygen–con
forming an
product is o
iated with o
(a) and anod
firmed by X
presented in
04–0836) in
by electrolys
2e Cu a
oxidation p
odic reactio
solutions is
deposited f
aled on CV
nditions, du
ly deposited
oxide is form
taining nucl
oxygen–con
xidized, wit
xygen (e.g. P
ic (b) product
RD analysi
Figure 3 sh
the cathodi
ing leached
nd Pb2+ + 2
rocesses [1
n is conduc
– 0.12 V a
rom strongl
scans. These
e to slow ele
and lead d
ed by the f
eus on the
taining inte
h the transf
bሺOHሻଶଶା ty
s.
s of product
ow diffracti
c product an
solution
e Pb).
1]. These
ted in a
nd under
y acidic
data are
ctrolysis
ioxide is
ollowing
electrode
rmediate
er of the
pe); and
s formed
on peaks
d 25.5°,
32
car
for
of
for
cop
of
is p
lea
lea
Th
cop
cat
of
fur
.0°, and 49.5
d No. 37–05
To clarify
med after th
both produc
Clearly, t
copper and
per purifica
Figure 4. X
On the ba
lead and cop
arallely rem
d dioxide an
d nitrate, co
e obtained v
The turni
per–lead m
hodic curren
current den
ther investig
° for β–PbO
17) in the an
the necess
e first step a
ts were comp
he XRD pat
the addition
tion.
RD patterns f
sis of these
per was def
oved by cat
d metallic c
pper nitrate,
oltammogra
ng points o
ixed solutio
t density fo
sity were va
ation of the
2 (JCPDS c
odic produc
ity of the s
nd second st
ared in Figu
terns for pro
al second el
or the produc
preliminary
ined: lead ca
hodic depos
opper remov
and for their
ms are prese
f potential
ns (Figure 5
r both soluti
ried in a ra
electrolytic
ard No. 14–
t.
econd step
ep of electro
re 4.
ducts of two
ectrolysis ste
ts after first (a
data, the po
n be anodic
ition as pure
al, LSV sca
mixed solu
nted in Figu
sweep scan
). This pote
ons. Similar
nge of 30 to
process.
4192) and 3
of copper c
lysis were a
processes w
p in Figure
) and second
ssibility of
ally deposite
metal. To id
nning was c
tions in a po
re 5.
are consiste
ntial value i
scans were r
40 mA/cm
Tran Th
6.5°, 52.0°
athodic dep
lso examine
ere similar
1 may not b
(b) step of ca
electrochem
d in the diox
entify electr
onducted fo
tential wind
nt at –0.30
s equivalent
epeatedly p
2 and this r
i Phuong Th
for α–PbO2
osition, the
d. The XRD
at 2θ = 43.
e required fo
thodic depos
ical recover
ide form an
olytic param
r separately
ow of –0.9 t
6 V for co
to 38.34 m
erformed an
ange was ch
ao, et al.
135
(JCPDS
products
patterns
5°, 50.6°
r further
ition.
ing route
d copper
eters for
prepared
o –0.1 V.
pper and
A/cm2 of
d all data
osen for
Co
13
the
eff
sum
we
Dc
Eff
Da
Eff
an
mA
ran
ne
va
com
eff
pper and lea
6
Selective
electrolytic
iciencies ob
marized in
re calculated
Figure 5.
Tab
(mA/cm2)
iciency (%)
Ta
(mA/cm2)
iciency (%)
The catho
d tend to de
/cm2. In co
ge with a s
cessary curre
lues of the p
Copper an
pared to
ectively reco
d recovery
and effectiv
parameters
tained by co
Table 3 and
by Faraday
LSV course fo
le 3. Relation
9
ble 4. Relatio
8
dic depositi
crease with
ntrary, lead
harp rise is
nt density c
roduct to be
d lead are p
other metal
vered from
from discard
e removal o
defined fro
nventional w
Table 4. Th
law.
r the mixed (
between cath
30
7.61
n between an
30
2.72
on efficienci
increasing
recovery e
observed a
an be select
recovered on
4.
resented in
’s constitue
their acidic
ed printed c
f metals from
m above ch
eight gain
e theoretical
LSV–HH) an
odic current d
35
95.40
odic current d
35
83.80
es reported
current dens
fficiencies a
t 50 mA/cm
ed dependin
each electr
CONCLU
discarded P
nts. Based
leached solu
ircuit boards
PCB leach
osen data. T
method and
copper and
d separate co
ensity and co
ensity and le
in Table 3, a
ity in the in
re increased
2 current de
g on efficien
ode.
SIONS
CB scraps w
on these re
tions by elec
by electrolys
ate has been
he relation
the applied
lead content
pper and lead
pper removal
40
91.91
ad removal ef
40
84.96
re considera
vestigated r
with curre
nsity (Table
cy requirem
ith substant
sults, copp
trodepositio
ing leached
conducted
between ele
current den
s as stated in
nitrate soluti
efficiency.
5
92
ficiency.
5
96
bly high abo
ange from
nt densities
4). In prac
ents, consid
ially higher
er and lead
n.
solution
based on
ctrolytic
sities are
part 2.2
ons.
0
.43
0
.59
ve 90 %
30 to 50
in same
tice, the
ering the
contents
can be
Tran Thi Phuong Thao, et al.
137
A preliminary procedure of the recovery process is proposed with the following steps:
disposal of the mounted electrical elements, cleaning, grinding, iron separation for grains
screening, metal dissolution, and electrolysis.
Copper and lead were recovered using electrochemical technique from discarded PCB
scraps. The high recovery efficiencies, 97.61% and 96.59% for copper (in metallic form) and
lead (in dioxide form), respectively, were reached.
REFERENCES
1. Baldé C. P., Wang F., Kuehr R., Huisman J. – The global e–waste monitor – 2014, United
Nations University, IAS – SCYCLE, Bonn, Germany, 2015.
2. Xu Y., Lia J. H., Liu L. L. – Current status and future perspective of recycling copper by
hydrometallurgy from waste printed circuit boards, Procedia Environmental Sciences 31
(2016) 162–170.
3. Vijayaram R., Nesakumar D., Chandramohan K. – Copper extraction from the discarded
printed circuit board by leaching, Research Journal of Engineering Sciences 2 (1) (2013)
11–14.
4. Andrea M., Keith S. – Leaching and electrochemical recovery of copper & lead and tin
from scrap printed circuit boards, Journal of Chemical Technology and Biotechnology 77
(4) (2002) 449–457.
5. Kumar M., Lee J. C., Kim M. S., Jeong J., Yoo K. – Leaching of metals from waste
printed circuit boards (WPCB) using sulfuric acid and nitric acid, Environmental
Engineering and Management Journal 13 (10) (2014) 2601–2607.
6. Veit H. M., Bernades A.M., Ferreira J.Z. et al. – Recovery of copper from printed circuit
boards scraps by mechanical processing and electrometallurgy, Journal of Hazardous
Materials 137 (3) (2006) 1704–1709.
7. Cayumil R., Khanna R., Rajarao R., Mukherjee P. S., Sahajwalla V. – Concentration of
precious metals during their recovery from electronic waste, Waste Management 57
(2016) 121–130.
8. Zhang Y. H., Liu S. L., Xie H. H., Zeng X. L., Li. J. H. – Current status on leaching
precious metals from waste printed circuit boards, Procedia Environmental Sciences 16
(2012) 560–568.
9. Nguyen T. T. H., Dang T. D., Mai T. T., Hoang T. B. T. – Copper recovery from e–waste
via leaching–electrodeposition: the influence of parameters, Journal of Science &
Technology 53 (1B) (2015) 355–362.
10. Cui J. R., Zhang L. F. – Metallurgical recovery of metals from electronic waste: A review,
Journal of Hazardous Materials 158 (2008) 228 – 256.
11. Tavares E. de F. L., et al. – An alternative method for the simultaneous determination of
copper and lead for quality control of sugar cane spirit using a nanotube–based sensor,
Journal of Brazilian Chemical Society 23 (9) (2012) 1614–1622.
12. Velichenko A. B., Baranova E. A., Girenko D. V., Amadelli R., Kovalev S. V., Danilov F.
I. – Mechanism of electrodeposition of lead dioxide from nitrate solutions, Russian
Journal of Electrochemistry 39 (6) (2003) 615–621.
Các file đính kèm theo tài liệu này:
- 12100_103810382688_1_sm_8971_2061700.pdf